Mechanic LW50 138°C Lead-Free Solder Paste 50G – BGA & SMD Rework Paste

Mechanic LW50 is a 138°C low-temperature lead-free solder paste built for mobile phone motherboard and BGA rework. The Sn42/Bi58 alloy melts at a lower point than standard tin-lead paste, so you protect sensitive ICs and heat-limited components during CPU repotting, chip reballing, and IC change jobs. The no-clean, non-corrosive flux leaves a transparent residue after soldering, cutting cleanup time on the repair bench. Packed in a 50g jar for repeated daily use, this paste gives technicians strong solder-stickiness, smooth flow, and reliable joints on Android and iPhone boards. A dependable pick for any GSM workshop handling dead phone repair and hardware fault diagnosis.