RF4 RF-FT09 Trackless Planar CPU IC Repair Fixture for BGA De-Gumming

The RF4 RF-FT09 is a trackless planar repair fixture built for technicians who work daily on dead phone motherboards and BGA chip removal. It replaces the old screw-type clamp with a press-and-release mechanism, so you open it with one hand and lock it instantly. CNC precision molding keeps the clamping force even across CPU, IC, and small PCB sections, supporting a maximum clamping size of 21mm x 46mm. Use it on your repair bench for glue removal, pin straightening, and soldering prep without the chip shifting mid-task. At just 0.30 kg, it sits comfortably under a microscope or hot air station setup in any GSM workshop.